Equipment introduction:
Semiconductor side pumped solid laser marking machine CE-DP100C using the most advanced laser technology, laser diode pumped by 808nm laser diode: YAG medium, the medium produced a large number of inverted particles, the role of the Q switch to form a 1064 pulse laser output, high electro-optic conversion frequency. With a small spot, high precision, stable, reliable, fast and easy to debug, and the effect is more easy to debug, and the power consumption is low, the processing cost is low, which can meet the full load operation for 24 hours.
Equipment characteristics:
The structure of the machine is greatly improved. The optical system adopts full seal structure, with the light path preview and focus indicator function, the appearance is more beautiful, the operation is more convenient, the machine is equipped with the latest external water cooling system, the use of noise and low temperature adjustment, which provides a reliable guarantee for the operation of the machine. DP series also can be used in conjunction with the production line and automatic production line equipment.
Application industry:
Applicable to the use of non metal and metal materials, widely used in different industries and fields, mainly covers mobile communications, integrated circuit (IC), metal products, jewelry, auto parts, plastic buttons, tools, electronic components, building materials, electrical appliances, precision instruments, food and pharmaceutical packaging, PVC pipe, medical equipment and other industries.
Main technical parameters:
Type CE-DP100C
Laser wavelength 1064nm
Laser power 100W
Laser repetition rate 0kHz-100kHz
Minimum Xian Kuan 0.01mm
The marking speed is less than 7000mm/s
Marking depth is less than or equal to 0.3mm (by materials)
Repeat accuracy 0.003mm
300X300mm 70x70mm--
Cooling mode constant temperature circulating cooling water (50w/100w)
Working power supply AC220V/50Hz/2.0kVA (10A-20A) |
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